Heat sink Product List and Ranking from 15 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

Heat sink Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. LSIクーラー Tokyo//others
  2. null/null
  3. ワイドワーク Tokyo//Trading company/Wholesale
  4. 富士商会 Tokyo//others
  5. 高木製作所 Ibaraki//others
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Heat sink Product ranking

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. Flexible heat sink LSIクーラー
  2. Heat sink for Intel Socket LGA3647 ワイドワーク
  3. Heat sink for high-performance forced air cooling "YK/YU/YX series" LSIクーラー
  4. Aluminum Water-Cooled Heat Sink "YC Series" LSIクーラー
  5. 4 【Heating/Cooling Device Components】Heat Sink Product Lineup List

Heat sink Product List

1～15 item / All 44 items

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Copper water-cooled heat sink

Copper water-cooled heat sink

Immediate delivery is possible for in-stock items! We have a variety of standard products available, ranging from 20mm square to 1m in length, suitable for various applications.

We would like to introduce our copper water-cooled heat sinks. We offer a lineup including the "P-100S," suitable for CPUs and Peltier elements, as well as the "L-100S" and "R-1000T." We have standard products ranging from 20mm square to 1m in length to suit various applications. Since these are in stock, they can be delivered immediately, and we also sell peripheral equipment such as cooling water circulation systems. Additionally, we are open to inquiries about custom products. 【Features】 ■ Excellent cooling capacity ■ Standard products available from 20mm square to 1m in length for various applications ■ Immediate delivery possible due to stock availability ■ Peripheral equipment such as cooling water circulation systems also available ■ Custom product inquiries are welcome *For more details, please refer to the PDF document or feel free to contact us.

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Water-cooled heat sink for UV-LED

Water-cooled heat sink for UV-LED

Made of oxygen-free copper with excellent thermal conductivity and durability! In addition to 8 types of standard products, we can also manufacture various custom products according to your needs.

In recent years, the demand for UV-LED has significantly expanded. We would like to introduce the "water-cooled heat sink" that maximizes its performance. Made of copper, which excels in performance and durability, it is lightweight due to its thickness of 3 to 15 millimeters. In addition to eight standard types compatible with various manufacturers' LEDs, we can also custom-make sizes up to approximately 500×800 millimeters. Upon request, we can perform processing such as tapping, notching, surface treatment, and helicoil installation. Please feel free to contact us. 【Features】 ■ Made of oxygen-free copper, excellent in thermal conductivity and durability ■ Lightweight due to its thickness of 3 to 15 millimeters ■ In addition to eight standard types, various custom products can be manufactured according to application ■ Socket types available include pipe, bamboo shoot type, PT thread, and nut fastening ■ Three types available (double-sided mounting/single-sided mounting/ultra-thin) *For more details, please refer to the PDF document or feel free to contact us.

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Heat sink for LGA1156/1155/1150/1151

Heat sink for LGA1156/1155/1150/1151

Fanless heatsink for cooling the CPU. Compatible with Intel Socket LGA1156/1155/1150/1151.

Fanless CPU cooler compatible with Intel Socket LGA1156/1155/1150/1151. It is mainly used for 1U rack-mounted servers and small industrial equipment. Since this product is fanless, its cooling performance is affected by the usage environment. To cool it, it is necessary to direct airflow from outside onto the heatsink. This product is often used in environments where blower fans are installed or where small fans are arranged, such as in 1U rack-mounted servers. A copper plate is attached to the CPU contact surface of the aluminum heatsink, and heat pipes are also used. The heat pipes efficiently transfer heat, allowing the CPU's heat to dissipate quickly.

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Heat sink for Intel Socket LGA3647

Heat sink for Intel Socket LGA3647

Fanless heat sink for cooling the CPU. Compatible with Intel Socket LGA3647.

Fanless CPU cooler compatible with Intel Socket LGA3647. It is mainly used for 1U rack-mounted servers and small industrial equipment. Since this product is fanless, its cooling performance is affected by the usage environment. To cool it, it is necessary to direct airflow from outside onto the heatsink. This product is often used in environments where blower fans are installed or in 1U rack-mounted servers with small fans arranged. It features a heatsink structure with aluminum fins stacked and crimped onto an aluminum base bottom.

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Heat sink for Intel Socket LGA3647

Heat sink for Intel Socket LGA3647

Fanless heatsink for cooling the CPU. Compatible with Intel Socket LGA3647.

Fanless CPU cooler compatible with Intel Socket LGA3647. It is mainly used for 1U rack-mounted servers and small industrial equipment. Since this product is fanless, its cooling performance is affected by the usage environment. To cool it, it is necessary to direct airflow from outside onto the heatsink. This product is often used in environments where blower fans are installed or where small fans are arranged, such as in 1U rack-mounted servers. It features a heatsink structure with a copper base and stacked aluminum fins that are crimped and joined together.

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Heat sink for Intel Socket LGA3647

Heat sink for Intel Socket LGA3647

Fanless heat sink for cooling the CPU. Compatible with Intel Socket LGA3647.

Fanless CPU cooler compatible with Intel Socket LGA3647. It is mainly used in 2U rack-mounted servers and small industrial equipment. Since this product is fanless, its cooling performance is affected by the usage environment. To cool it, it is necessary to direct airflow from outside onto the heatsink. This product is often used in environments where blower fans are installed or in 2U rack-mounted servers with small fans arranged. It features a heatsink structure that combines a copper base with stacked aluminum fins. A copper plate is attached to the CPU contact surface of the aluminum heatsink, and heat pipes are also used. The heat pipes efficiently transfer heat, allowing for quick dissipation of the CPU's heat.

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Heat sink for LGA1156/1155/1150/1151

Heat sink for LGA1156/1155/1150/1151

Fanless heatsink for cooling the CPU. Compatible with Intel Socket LGA1156/1155/1150/1151.

Fanless CPU cooler compatible with Intel Socket LGA1156/1155/1150/1151. It is mainly used in 2U rack-mounted servers and small industrial equipment. Since this product is fanless, its cooling performance is affected by the usage environment. To cool it, it is necessary to direct airflow from the outside onto the heatsink. This product is often used in environments where blower fans are installed or in 2U rack-mounted servers with small fans arranged. The heatsink is a one-piece molded component made from machined aluminum ingots (material in block form).

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[Case Study] Optimization of Heat Sink Shape

[Case Study] Optimization of Heat Sink Shape

We will introduce a case study on the optimization of heat sink shapes, which is important for CPU heat dissipation measures!

We would like to introduce a case study where the "modeFRONTIER" was applied to optimize the shape of a heat sink. As a countermeasure to the heat generation problem of CPUs used in computers and other devices, it is very important to optimize the heat dissipation performance of heat sinks. With the multi-purpose optimization of "modeFRONTIER," it is possible to explicitly present a lineup of heat sinks with high heat dissipation performance that are suitable for the diversifying product shapes as Pareto solutions. [Case Study] ■ Software Used: modeFRONTIER ■ Objective: Countermeasure for CPU heat generation in computers and other devices ■ Challenge: Optimize the heat dissipation performance of heat sinks ■ Result: By using multi-purpose optimization, a lineup of heat sinks with high heat dissipation performance suitable for diversifying product shapes was explicitly presented as Pareto solutions. *For more details, please refer to the external link or feel free to contact us.

  • Company：IDAJ
  • Price：Other
  • Scientific Calculation and Simulation Software
  • Analysis and prediction system

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【Prototype Case of Sand Casting】HEAT SINK (Prototype)

【Prototype Case of Sand Casting】HEAT SINK (Prototype)

A successful case of casting a fin with a thickness of 1.25mm using gravity casting in die-casting prototyping!

We would like to introduce a prototype example of a "HEAT SINK." The product weight is 800g, and the dimensions are 280×110×55. We successfully cast a die-cast (mass production) prototype with a fin thickness of 1.25mm using gravity casting (self-weight). 【Overview】 ■ Material: AC4B-F ■ Delivery Industry: Automotive-related ■ Supported Lot Size: 1 to 100 pieces ■ Product Weight: 800g ■ Product Size: 280×110×55 *For more details, please refer to the PDF document or feel free to contact us.

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Heat sink

Heat sink

Quickly transfers heat.

This is a radiator for electronic components that prevents the destruction of devices by quickly transferring and cooling heat. It mainly consists of a base plate to which the heat-generating element is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to forcibly circulate air or using cooling media such as water. *Online meetings are also available, so please feel free to contact us.*

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Heat sink for pin-mounted devices P/FP/U series

Heat sink for pin-mounted devices P/FP/U series

The P/FP series is of the aluminum extrusion type, while the U series is of the plate type.

We are pursuing high performance for heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most heat sinks consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to forcibly circulate air or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat processing with heat sinks. The P/FP/U series of heat sinks for pin-mounted devices consists of the P/FP series, which is an aluminum extrusion type, and the U series, which is a plate type. *Online meetings are also possible, so please feel free to contact us.

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Heat sink, multipurpose, general-purpose F/H/M series

Heat sink, multipurpose, general-purpose F/H/M series

The F/H/M series is an aluminum extruded fin-type heat sink.

We are pursuing high performance in heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most of them consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to force air circulation or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat treatment with heat sinks. The multi-purpose, general-purpose F/H/M series heat sinks are aluminum extruded fin-type heat sinks. *Online meetings are also possible, so please feel free to contact us.

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Heat Sink Hollow Type (Medium Power Forced Air Cooling) V Series

Heat Sink Hollow Type (Medium Power Forced Air Cooling) V Series

The V series is an aluminum extruded type hollow fin heat sink designed for forced air cooling.

We are pursuing high performance in heat sinks and radiators. Semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to forcibly circulate air or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat treatment with heat sinks. The hollow type heat sink (for medium power forced air cooling) V series is an aluminum extruded type hollow fin heat sink for forced air cooling. *Online meetings are also possible, so please feel free to contact us.

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Heat Sink for Stud-Type Devices S Series

Heat Sink for Stud-Type Devices S Series

The S series is a heat sink for stud-type devices with aluminum extrusion.

We are pursuing high performance for heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most of them consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to force air convection or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat processing with heat sinks. The S series heat sink for stud-type devices is an aluminum extruded type heat sink designed for stud-type devices. *Online meetings are also possible, so please feel free to contact us.

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Heat sink for high-performance forced air cooling "YK/YU/YX series"

Heat sink for high-performance forced air cooling "YK/YU/YX series"

The YK/YU/YX series is a high-performance forced air cooling type with a comb fit design.

We are pursuing high performance for heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated from the devices if cooling is not performed during operation. 【Features】 〇 A radiator for electronic components that prevents device destruction → Quickly transfers heat for cooling 〇 Composed of a base plate for mounting heat-generating devices and fins for dissipating heat from the base plate 〇 High-performance forced air cooling 〇 Comb-fit type 〇 YK series → Fin-joint type single-sided base 〇 YU series → Fin-joint type single-sided base (narrow pitch) 〇 YX series → Fin-laminated hollow double-sided base type *Online meetings are also possible, so please feel free to contact us.

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